Micron Technology

Semiconductor

ENGINEER,HighBandwidthMemory(HBM)&NewProductIntroduction(NPI)

S$350–600k ~AI est. Singapore, Singapore Remote Friendly
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid+ candidates.

The Brief

“ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI) at Micron Technology. Skills: High Bandwidth Memory, New Product Introduction, Advanced Packaging”

Industry & Context.

Semiconductor
Problems you'll solve

Problem-solving

Eligibility Requirements

Shift coverage, Weekend coverage

How You'll Work.

Team & Collaboration

Development Team; Manufacturing teams; Supplier teams; Global network

Communication Scope

Effective communicator

Full Job Description

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Development Team & Manufacturing and supplier teams across Micron’s global network. **Main Responsibilities** * Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness. * Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enablement enhancement within one scope of work. * Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications. * Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR). * Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans

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