Collins Aerospace

aerospace and defense

ElectricalEngineerII-MicroelectronicsPackaging

$85–115k ~AI est. Cedar Rapids, Iowa, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid candidates.

The Brief

“Electrical Engineer II - Microelectronics Packaging at Collins Aerospace. Skills: Microelectronics Packaging, Mechanical Design, Failure Analysis. Coordinate research and development. Execute research and development”

Industry & Context.

aerospace and defense
Problems you'll solve

Failure analysis; Root cause analysis

Eligibility Requirements

U. S. government security clearance, DoD Clearance: Secret, Active security clearance

What They're Looking For.

Must Have

Degree in STEM, 2 years relevant experience, Obtain security clearance, U.S. citizenship required, Mechanical design and analysis, Proficiency in CAD tools, Working knowledge of analysis tools, Comfortable working on defense programs

Nice to Have

Microelectronics design and manufacturing, Microelectronics packaging materials, Additive manufacturing for electronics, Flip chip experience, Understanding of RF/Highspeed signal integrity, Decompose mechanical requirements, Experience with cost account management, Experience with schedule management, Read basic electrical schematics, Review basic electrical schematics, Work in a team environment, Interact with various engineering disciplines

What You'll Do.

Coordinate research and development

Execute research and development

Packaging conceptualization

Technology development

Lead moderately sized projects

Execute moderately sized projects

Qualification testing

Support manufacturing

Manufacturing failure analysis

Root cause failure analysis

How You'll Work.

Team & Collaboration

Collaborative team environment; Various engineering disciplines

Process & Methodology

Cost account management, Schedule management

Full Job Description

**Date Posted:** 2026-06-03 **Country:** United States of America **Location:** US-IA-CEDAR RAPIDS-108 ~ 400 Collins Rd NE ~ BLDG 108 **Position Role Type:** Onsite **U.S. Citizen, U.S. Person, or Immigration Status Requirements: ** The ability to obtain and maintain a U.S. government issued security clearance is required.​ U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance **Security Clearance Type:** DoD Clearance: Secret **Security Clearance Status:** Active and existing security clearance required after day 1 At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world. Collins Aerospace is a leader in technologically advanced, intelligent solutions that help redefine the aerospace and defense industry. With a comprehensive portfolio and deep technical expertise, we help customers meet the demands of the global market. Join us and help shape the future of aerospace and defense. Join the Applied Research & Technology (ART) team at Collins Aerospace as a Microelectronics Packaging Engineer II and help develop the next generation of advanced aerospace and defense technologies. As part of a team driving microelectronics packaging innovation across the enterprise, you will contribute to the design, development, and transition of cutting-edge packaging solutions from concept through production. In this role, you will lead moderately sized projects and support all phases of product development, including technology development, package design, prototyping, testing, qualification, manufacturing transition, and production support. The ideal candidate is a m

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