DryEtchProcessDevelopEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Dry Etch Process Engineer you will develop, integrate, and optimize plasma etch processes that enable next-generation memory devices. You will work hands-on with etch equipment, chamber hardware, consumables, and metrology, using data-driven methods to improve critical dimension control, profile, selectivity, uniformity, and defect performance. You will collaborate closely with integration, lithography, thin films, CMP, device, and manufacturing teams to mature processes from R&D into high-volume manufacturing. This role is full time at the NYC site in Albany, New York. You will collaborate with our EUV Photo Lithography process team in NYC, and our Technology Development (TD) teams in Boise, USA and Hiroshima, Japan sites to develop robust dry etch solutions aligned to Micron’s technical roadmap. NYC is a diverse consortium, and you will have many opportunities to work closely with suppliers and other companies while protecting Micron’s intellectual property (IP). **Responsibilities:** * Develop, qualify, and sustain dry etch (plasma) unit processes for advanced memory technologies (e.g., dielectric, conductor, and hardmask etch) * Optimize critical process metrics including CD control, etch profile/anisotropy, selectivity, microloading, uniformity, and line edge/line width roughness * D