DRAMProcessIntegrationEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration engineer in the 3D DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling! You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. **Responsibilities include, but not limited to:** * Lead technology integration activities in enabling manufacturability of pioneering DRAM technology, working on device components such as charge storage devices and thin-film transistors (TFTs), among others. * Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to yield and margin issues * Design and handle experiments in the R&D fab * Optimize process flows and develop creative solutions to meet product requirements. * Extract, supervise, analyze, and react to inline data, defect data, param data and probe data to fix yield issues, performance, reliability, add process margin and reduce costs. * Lead continuous yield improvement and cost reduction activities. * Summarize sophisticated problems, derive, explain actions taken to address them and drive team to implement them. **Minimum Qualifications:** * Detailed k