Director–PackageMaterialsIntegration,APTD

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron’s advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues. **Responsibilities will include, but are not limited to:** * Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs. * Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.). * Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs. * Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines. * Partner with process en