Renesas Electronics
semiconductor
DirectorofAdvancedICPackagingDevelopment
“Director of Advanced IC Packaging Development at Renesas Electronics. Skills: Advanced IC Packaging Development, Power SiP/Modules, Wafer Level Packaging, Flip-Chip technologies, Wide Bandgap (SiC/GaN) solutions. Define and execute the global packaging roadmap. Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices”
What You'll Achieve.
enabling the AI and Datacenter revolution; ensuring Renesas remains at the forefront of power density and thermal efficiency; ensure manufacturability and reliability; optimize assembly processes; ensure superior quality; ensure exhaustive window checks on critical process steps; prevent quality incidents and excursions; provide root-cause analysis and resolutions; Make Our Lives Easier
Industry & Context.
resolve integration issues; Resolve process integration bottlenecks; root-cause analysis and resolutions
dual-use technology that is subject to U.S. export controls regulations
What They're Looking For.
Must Have
Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering, 15 to 20 years of relevant experience in semiconductor package development, Deep knowledge of Power SiP/Modules, Flip-Chip, and Wafer Level assembly, Familiarity with Smart Power Stages and Vertical Power architectures, Expertise in SPC, statistical analysis software, and qualification methods
What You'll Do.
Define and execute the global packaging roadmap
Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices
Manage the annual R&D budget
oversee customer adoption programs
Establish and maintain corporate package design rules
and qualify global OSATs and Contract Manufacturers (CM)
Drive DOE (Design of Experiments) with partners
Monitor production early in the ramp phase
Lead the transition of new products from R&D to High Volume Manufacturing (HVM)
Collaborate with Product and Reliability teams to qualify new packages
Resolve process integration bottlenecks
Implement SPC (Statistical Process Control) and production monitors
Act as the technical authority for internal and external customer complaints
staying current on industry innovations in interconnect methods
How You'll Work.
Team & Collaboration
Collaborate with Product and Reliability teams; working with Marketing, Quality, and Operations
Communication Scope
presentation skills; communication skills
Process & Methodology
Manage the annual R&D budget, Lead the transition of new products from R&D to High Volume Manufacturing (HVM)
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