Micron Technology
Semiconductor
Director,HBMRTLDesignandIntegration
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“Director, HBM RTL Design and Integration at Micron Technology. Skills: HBM RTL Design, SoC Integration, Team Leadership. Lead SoC RTL design. Lead HBM logic die integration”
What You'll Achieve.
Ensure successful end-to-end product execution; Ensure robust, manufacturable HBM solutions; Ensure optimal product outcomes
Industry & Context.
What They're Looking For.
Must Have
Proven experience leading large-scale SoC design teams, Deep expertise in RTL design, SoC integration expertise, Full RTL-to-GDS flows expertise, Experience integrating complex IP subsystems, Familiarity with EDA tools, Familiarity with scripting languages
Nice to Have
15+ years of relevant SoC design experience, Demonstrated success driving multiple tape-outs, Demonstrated success driving cross-functional SoC programs, Leadership skills, Communication skills, Organizational influence skills, Experience building global engineering teams, Experience managing global engineering teams
What You'll Do.
Lead HBM logic die integration
Lead subsystem partitioning
Lead SoC-level design convergence
Drive translation of specifications
Oversee SoC integration aspects
Establish design methodologies
Establish best practices
Partner with SoC Architecture
Partner with Verification
Partner with Physical Design
Partner with Firmware
Partner with System teams
Work closely with Product Engineering
Work closely with Test
Work closely with Probe
Work closely with Process Integration
Work closely with Assembly
Work closely with Manufacturing
Build high-performing RTL design team
Lead high-performing RTL design team
Scale high-performing RTL design team
Recruit engineering talent
Mentor engineering talent
Retain engineering talent
How You'll Work.
Team & Collaboration
Cross-functional teams; Architecture teams; Verification teams; Physical design teams; Firmware teams; System teams; Product engineering teams; Test teams; Probe teams; Process integration teams; Assembly teams; Manufacturing teams
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about driving innovation for next-generation memory solutions powering AI/ML and high-performance computing systems. As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams. **Key Responsibilities** * Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence. * Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams. * Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness. * Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs. * Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution. * Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM solutions. * Drive trade-offs among performance, power, area, schedule, and risk to ensure optimal product outcomes. * Build, lead, and scale a high-performing RTL design and integra
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