DesignArchitecture,PrincipalEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **HBM Design Architecture — Principal Engineer** **Role Overview** We are seeking a highly motivated **HBM Design Architecture Engineer (Principal Engineer)** to drive exploration and definition of next‑generation AI memory and system environments. In this role, you will analyze emerging infrastructure trends, build performance models, and develop/extend tooling that informs HBM architecture decisions and system‑level trade‑offs. You will work closely with architects and senior engineers across DTPCO, Design, and Product/System teams to translate AI workload requirements into actionable memory subsystem and architectural intercept strategies. **Key Responsibilities** You will own and contribute to projects such as: * **Research and synthesize emerging trends** in compute, networking, and storage infrastructure to anticipate how future AI systems will evolve. * **Lead HBM architecture analysis** by defining bandwidth/latency targets, identifying constraints, and translating workload and system data into actionable memory requirements. * **Develop and maintain simulation frameworks** to model AI cluster performance and memory subsystem behavior; validate models against internal and external benchmarks. * Build and apply **first‑order performance models** spanning HBM bandwidth/latency, GPU/CPU interactions, and memory hierarchy trade‑offs to guide architectural decisions. * Create and curate **trend dashboards** using CSP benchmarks and industry datasets; communicate insights, assumptions, and sensitivity analyses to stakeholders. * Partner across DTPCO, Design, and Product/System teams to define **architectural intercept opportunities** , align on requirements, an