NVIDIA

Semiconductor

ChipLead,SiliconCo-DesignGroup

$196–368k Santa Clara, California, United States FULL TIME Remote Friendly
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Lead candidates.

The Brief

“Chip Lead, Silicon Co-Design Group at NVIDIA. Skills: technical lead for silicon programs, technical integrity end-to-end, guide co-design feature integration, resolve multi-functional bugs, steward qualification playbook, shape technical narrative, mentor Chip Leads, contribute to SCG-wide methodology, lead Critical Debug and SCG Technical Execution forums, represent chip externally. Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs.. Co-lead ”

What You'll Achieve.

deliver chips that change what is possible; program runs cleaner because you are on it; faster bring-up; fewer escapes; yield recovery; methodology contributions

Industry & Context.

Semiconductor
Problems you'll solve

resolve the program’s hardest multi-functional bugs; turning ambiguous, multi-team failure modes into root-cause closure

What They're Looking For.

Must Have

BS or MS (or equivalent experience) in Electrical or Computer Engineering, over a decade of proven track record in post-silicon bring-up, validation, or system integration leadership at a major semiconductor company, work on multiple shipped silicon products, 12+ years of experience, end-to-end understanding of SoC and ASIC architecture, recognized expertise in at least one subsystem such as HBM, SerDes, power and thermal, or packaging, Specific examples of silicon-level impact, such as faster bring-up, fewer escapes, yield recovery, or methodology contributions, turning ambiguous, multi-team failure modes into root-cause closure with reusable workarounds and write-ups, A track record of guiding technical decisions across functional boundaries without direct reporting authority, translating sophisticated silicon issues into clear options for executive audiences

Nice to Have

Prior experience as a Chip Lead, Project Tech Lead, or Principal or Distinguished Engineer on a flagship GPU, AI accelerator, CPU, networking ASIC, or other large SoC, Patents, conference papers, invited talks, or recognized contributions to silicon validation, post-silicon debug, or co-design integration, A history of building and sharing technical methodology beyond a single program — reusable playbooks, debug frameworks, or standards adopted by other teams, Hands-on debug experience with HBM, high-speed I/O, power and thermal, or packaging, Comfort working through ambiguity with globally distributed teams, habit of surfacing the right risks and recommendations to leadership without being asked, using AI tools to lift team velocity, not just personal productivity

What You'll Do.

Serve as the single technical point of contact for multi-functional decisions

Co-lead program-level feature integration from chip to system

surfacing inter-function dependencies and guiding them to resolution.

Help resolve the program’s hardest multi-functional bugs by translating ambiguous

multi-team symptoms into root-cause closure on areas such as HBM

Steward the qualification playbook. When the playbook does not fit a situation

guide the mitigations and capture the lessons as reusable methodology for other SSG programs.

Shape the program’s technical narrative by surfacing key risks

and mitigations as decision-ready options for executive leadership.

Mentor Chip Leads on adjacent silicon programs and contribute to SCG-wide methodology through post-mortems and write-ups.

Lead the program’s Critical Debug and SCG Technical Execution forums

and represent the chip externally with early insight into technical risks.

How You'll Work.

Team & Collaboration

partner across design, validation, software, and manufacturing; Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs.; Co-lead program-level feature integration from chip to system, surfacing inter-function dependencies and guiding them to resolution.; resolve the program’s hardest multi-functional bugs by translating ambiguous, multi-team symptoms into root-cause closure; guiding technical decisions across functional boundaries without direct reporting authority; translating sophisticated silicon issues into clear options for executive audiences; working through ambiguity with globally distributed teams

Communication Scope

translating sophisticated silicon issues into clear options for executive audiences; Shape the program’s technical narrative

Full Job Description

The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. NVIDIA’s Silicon Co-Design Group is hiring a Chip Lead to serve as the technical lead for one of our most consequential silicon programs! This is not project management, and it is not a senior IC role. You are the person the program partners with on its hardest technical questions — when the right answer is not obvious, and when leadership needs a single technical perspective to align on direction. You are accountable for the technical integrity of the chip end-to-end. You guide co-design feature integration, help resolve the toughest multi-functional bugs, and serve as the project-specific custodian of the qualification playbook. The program runs cleaner because you are on it! **What you’ll be doing:** You will partner across design, validation, software, and manufacturing to keep the program’s technical narrative clear and on track. Day to day, you will: * Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs. * Co-lead program-level feature integration from chip to system, surfacing inter-function dependencies and guiding them to resolution. * Help resolve the program’s hardest multi-functional bugs by translating ambiguous, multi-team symptoms into root-cause closure on areas such as HBM, power and thermal, high-speed I/O, and packaging. * Steward the qualification playbook. When the playbook does not fit a situation, guide the mitigations and capture the lessons as reusable methodology for other SSG programs. * Shape the program’s technical narrative by surfacing key risks, trade-offs, and mitigations as decision-ready options for executive leadership. * Mentor Chip Leads on adja

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