Nxp
AssemblyTechnicalProgramManager
Neural analysis suggests this role is
optimal for Senior candidates.
“Assembly Technical Program Manager at Nxp. Skills: Cost reduction, Assembly operations, Program management, Supplier engagement. Drive package cost breakthroughs. Optimize low-cost BOM”
What You'll Achieve.
Achieve breakthrough cost reductions; Enhance manufacturing efficiency; Enable next-generation package architectures; Drive cost competitiveness; Drive process efficiency; Drive BOM competitiveness; Ensure PCN success rate
Industry & Context.
Analytical and problem-solving capability
What They're Looking For.
Must Have
Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or a related field., 10–18+ years in semiconductor assembly / packaging engineering, Proven leadership in Cost reduction and value engineering programs, Proven leadership in QFN back end, in strip solutions and leadframe-based package technologies, Proven track record in Driving cross-site or global initiatives, Proven track record in Supplier collaboration and negotiation, Deep knowledge of Assembly processes especially Back end Leadframe design and high-density packaging, Cost modeling (BOM + process cost structures), Experience in Molding process optimization, Familiarity with PCN processes, JEDEC standards, and qualification flows, Strategic thinker with cost engineering mindset, Influential leader capable of driving alignment across BLs and suppliers, Analytical and problem-solving capability, Proven ability to lead change in complex, matrix organizations, Excellent communication skills with executive-level stakeholder management
What You'll Do.
Drive package cost breakthroughs
Optimize low-cost BOM
Reduce assembly process cost
Automate assembly processes
Lead QFN cost transformation
Develop super wide leadframe solutions
Implement high-density packaging solutions
Champion molding process efficiency innovations
Reduce mold cleaning cost
Coach engineer technical competency
Manage programs in matrix organization
Co-develop innovative BOM
Accelerate new material adoption
Accelerate process technology adoption
Lead cross-functional engagement
Ensure PCN success rate
Establish governance for change programs
Ensure risk assessment
Ensure validation processes
Drive data-driven decisions
How You'll Work.
Team & Collaboration
Collaborate with suppliers; Collaborate with material innovation; Collaborate with Business Lines; Engage with BLs on BOM changes; Drive alignment across BLs; Drive alignment with suppliers; Stakeholder management
Communication Scope
Excellent communication skills; Executive-level stakeholder management
Process & Methodology
Program Management, Program Management in a matrix organization, Lead strategic initiatives, Lead QFN cost transformation programs, Lead development and implementation, Lead cross-functional engagement, Establish structured governance, Drive data-driven decision-making
Full Job Description
**Role Summary** • This role is responsible for driving cost competitiveness, process efficiency and BOM competitiveness across NXP’s assembly operations. This role leads strategic initiatives to achieve breakthrough cost reductions, enhance manufacturing efficiency, and enable next-generation package architectures in close collaboration with suppliers, material innovation and Business Lines (BL). **Job Responsibility** 1.Package Cost Transformation Leadership * Drive package cost breakthroughs through: * Low-cost Bill of Materials (BOM) optimization * Assembly process cost reduction and automation * Lead QFN cost transformation programs, focusing on design-to-cost and manufacturability 2.Operation Process Innovation * Lead development and implementation of super wide leadframe / high-density packaging solutions * Champion innovations in molding process efficiency, mold cleaning cost reductions 3.People Management and Program Management * Coaching and Engineer technical compe6.tency improvements * Program Management in a matrix organization 4.Strategic Supplier Engagement * Partner with key assembly material and equipment to: * Co-develop innovative, cost-effective BOM, 2nd source, alternative BOM * Accelerate adoption of new materials and process technologies 5.Business Line (BL) & Stakeholder Management * Lead cross-functional engagement with BLs on BOM changes and PCN success rate 6.Change Management & Governance * Establish structured governance for cost and technology change programs * Ensure robust risk assessment, qualification, and validation processes * Drive data-driven decision-making and transparency across stakeholders **Job Qualification** • Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, Materials Engineering, or a related field. • 10–18+ years in semiconductor assembly / packaging engineering • Proven leadership in: Cost reduction and value engineering programs QFN back end, in strip solutions and leadframe-based package tec
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