Forefront RF

Semiconductor

AssemblyEngineer

£55–75k ~AI est. Cambridge, England, United Kingdom FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid+ candidates.

The Brief

“Assembly Engineer at Forefront RF. Skills: Semiconductor assembly, Packaging, Process development. Manage semiconductor assembly activities. Work with OSAT partners”

Industry & Context.

Semiconductor
Problems you'll solve

Root-cause analysis; Failure analysis; Problem-solving

What They're Looking For.

Must Have

Degree in Electronic Engineering, Materials Science degree, Manufacturing Engineering degree, Semiconductor assembly experience, Semiconductor packaging experience, Manufacturing engineering experience, Yield improvement experience, Failure analysis experience, Process optimisation experience

Nice to Have

RF semiconductor products experience, Mixed-signal semiconductor products experience, Reliability and qualification processes knowledge, Manufacturing data analysis familiarity, Process control familiarity, Advanced semiconductor packaging technologies understanding, Consumer semiconductor products experience, IoT semiconductor products experience, Automotive semiconductor products experience

What You'll Do.

Manage semiconductor assembly activities

Work with OSAT partners

Work with manufacturing partners

Support new product introduction

Support manufacturing readiness

Drive yield improvement

Root-cause analysis for assembly issues

Coordinate reliability testing

Coordinate qualification activities

Coordinate failure analysis

Collaborate with design teams

Collaborate with test teams

Collaborate with product engineering teams

Optimise manufacturability

Create assembly documentation

Maintain assembly documentation

Maintain process flows

Create manufacturing specifications

Maintain manufacturing specifications

Identify continuous improvement opportunities

How You'll Work.

Team & Collaboration

Design teams; Test teams; Product engineering teams; OSAT partners; Manufacturing partners

Process & Methodology

New Product Introduction

Full Job Description

**Assembly Engineer** **Location:** Cambridge, UK **Team:** New Product Introduction **Job Type:** Full-Time, Permanent **About Us:** Forefront RF is a fabless semiconductor company developing breakthrough RF technology that radically simplifies RF front-end architectures for mobile and connected devices. Our long-term vision is to empower anyone to treat global connectivity as a commodity, effortlessly adding it to any device. We lead through innovation, solving our customers’ toughest challenges, enabling them to stay ahead by pushing the boundaries of RF design. **Our Values:** Our values are the quiet nudge that help us to be our best in every interaction. * **One team** : We listen, share, and build solutions together. Collaboration is at the heart of how we work. We support one another, embrace challenges and fun, and celebrate collective success. * **Innovation with intent** : We operate at the forefront of technology, building innovative pathways to the future that meets real customer needs. * **Solutions driven** : We develop world leading manufacturable products that deliver effortless connectivity. * **Customer focused** : We act with integrity, hold ourselves accountable, and are guided by a deep commitment to deliver customer focused solutions. * **Sustainable** : We design for longevity and reuse - leveraging globally connected RF technology to extend product lifecycles and reduce waste. **Role Overview:** We’re looking for an Assembly Engineer to help drive the assembly and packaging activities behind our RF semiconductor products as we continue to scale the business. This is a newly created role and an exciting opportunity to shape how we develop and transition products from prototype through to volume production. You’ll work closely with design, test, operations, suppliers, and manufacturing partners in a hands-on engineering environment, helping deliver robust, scalable, and high-quality packaging solutions for next-generation products. **Key Respo

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