Annapurna Labs
Corporate Operations, ASIC, no business category
ASICII
Neural analysis suggests this role is
optimal for Mid candidates.
“ASIC II at Annapurna Labs. Skills: Signal integrity, Power integrity, ASIC design, Machine learning ASICs. Design SI/PI systems. Validate SI/PI systems”
What You'll Achieve.
Meet stringent performance requirements
Industry & Context.
Resolving complex SI issues; Debugging prototypes; Tackle novel challenges
What They're Looking For.
Must Have
Bachelor's degree or foreign equivalent, 2 years of experience, 1 year experience using time domain and frequency domain tools, 1 year experience with PCB, Package, interposers, and Silicon, 1 year experience in Transmission line theory and Electromagnetics
Nice to Have
Please see job description and the position requirements above
What You'll Do.
Validate SI/PI systems
Apply transmission line theory
Apply electromagnetics
Develop high-speed interfaces
Ensure system-level integrity
Validate simulation results
Correlate simulation results
Propose innovative solutions
Document simulation outcomes
Document measurement data
Document design trade-offs
Present recommendations
How You'll Work.
Team & Collaboration
Cross-functionally with silicon teams; Cross-functionally with packaging teams; Cross-functionally with board design teams; Cross-functionally with validation teams
Communication Scope
Present to stakeholders
Full Job Description
MULTIPLE POSITIONS AVAILABLE Employer: ANNAPURNA LABS (U.S.) INC. Offered Position: ASIC II Job Location: Austin, Texas Job Number: AMZ9679283 Position Responsibilities: Design and validate signal and power integrity (SI/PI) systems for next generation machine learning ASICs and customized hardware platforms optimized for AWS datacenter environments. Perform both time-domain and frequency-domain simulations using tools such as HSPICE, Cadence Sigrity, HFSS, and Keysight ADS, including 3D/2.5D EMIR analysis. Apply transmission line theory and electromagnetics to develop high-speed interfaces like SerDes and PCIe, resolving complex SI issues across digital systems. Collaborate cross-functionally with silicon, packaging, board design, and validation teams to ensure system-level integrity across PCB, interposers, and advanced SoC power delivery architectures using die-level capacitors (DTC, IPD). Use high-speed lab equipment to validate and correlate simulation results, while debugging prototypes to meet stringent performance requirements. Tackle novel challenges in interconnects and power delivery for large-scale compute environments by proposing innovative, high-impact solutions. Document simulation outcomes, measurement data, and design trade-offs, presenting clear recommendations to both technical and non-technical stakeholders while fostering a culture of continuous learning and engineering excellence Position Requirements: Bachelor's degree or foreign equivalent degree in Electrical or Computer Engineering or related field and two years of experience in the job offered or related occupation. Must have one year of experience in the following skills: (1) using time domain and frequency domain tools: Hspice, Sigrity, HFSS, or Microwave Studio; (2) with PCB, Package, interposers (COWOS) and Silicon Technologies; (3) in Transmission line theory and Electromagnetics and its application in SerDes, Single-ended signal and parallel bus interfaces. Amazon.com is an Equal Op
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