Annapurna Labs
Corporate Operations, ASIC, no business category
ASICII
Neural analysis suggests this role is
optimal for Mid candidates.
“ASIC II at Annapurna Labs. Skills: Thermal analysis, Liquid cooling, SoC design. Develop detailed CFD and compact RC models for. Optimize air and liquid cooled thermal solutions under”
What You'll Achieve.
Deliver a world class customer experience
Industry & Context.
Optimize thermal solutions; Simulate thermal control strategies; Validate thermal models
Domestic or international travel up to 25%
What They're Looking For.
Must Have
Master's degree or foreign equivalent in Mechanical Engineering, Thermal Engineering, or related discipline and 3 years of experience in mechanical engineering, thermal engineering or related, Bachelor's degree or foreign equivalent in Mechanical Engineering, Thermal Engineering, or related discipline followed by 5 years of progressively responsible post-baccalaureate experience in mechanical engineering, thermal engineering or related, 3 years of experience in Mechanical and Thermal design of both air and liquid cooled electronic Systems, 3 years of experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems, 3 years of experience with SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques, 3 years of experience with programming languages: Python, C++, and working in Linux environment
Nice to Have
All applicants must meet all the above listed requirements
What You'll Do.
Develop detailed CFD and compact RC models for
Optimize air and liquid cooled thermal solutions under
Simulate and prototype thermal control strategies
Validate thermal models through power/thermal measurements on Hardware
Design and optimization of hardware for large-scale data
Integrate liquid cooling facility
Identify new thermal-mechanical technologies for large-scale server deployments
Design new thermal-mechanical technologies for large-scale server deployments
Test new thermal-mechanical technologies for large-scale server deployments
Integrate new thermal-mechanical technologies for large-scale server deployments
Own thermal-mechanical design from chip SOC design to
See systems through to high volume manufacturing
Full Job Description
Employer: Annapurna Labs (U.S.) Inc. Position: ASIC II AMZ25487.3 Location: Austin, TX Multiple Positions Available: 1. Develop detailed CFD and compact RC models for SoC and Package thermal analysis 2. Knowledge of hardware and software based thermal / power management control algorithms 3. Optimize air and liquid cooled thermal solutions under PPA and system design constraints 4. Simulate and prototype thermal control strategies 5. Validate thermal models through power/thermal measurements on Hardware 6. Responsible for the design and optimization of hardware for largescale data center deployment including rack level integration, liquidcooling facility integration and serviceability 7. Identify, design, test and integrate new thermal-mechanical technologies for large-scale server deployments to deliver a world class customer experience. 8. Own thermal-mechanical design from the lowest levels of chip SOC design to rack assembly and see those systems all the way through to high volume manufacturing. 9. Domestic or international travel up to 25% to perform role responsibilities may be required (40 hours / week, 8:00am-5:00pm, Salary Range $141586 - $184000) Amazon.com is an Equal Opportunity – Affirmative Action Employer – Minority / Female / Disability / Veteran / Gender Identity / Sexual Orientation Basic Qualifications: Master’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline and 3 years of experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. In the alternative, employer will accept a Bachelor’s degree or foreign equivalent degree in Mechanical Engineering, Thermal Engineering, or a related discipline followed by 5 years of progressively responsible post-baccalaureate experience in the job offered or a related occupation in mechanical engineering, thermal engineering or related. Experience must include: 1) 3 years of experience in Mechanical and
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