Micron Technology

Semiconductor

APTDSGTDIntegrator

$1500–2500k ~AI est. Taichung, Taiwan FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid+ candidates.

The Brief

“APTD SG TD Integrator at Micron Technology. Skills: Packaging process, Process integration, Material qualification, Equipment qualification. Develop advanced packaging process solution. Ensure New Process, New Equipment, New Material and”

What You'll Achieve.

Ensure 1st pass rate; Meet new Technode requirements and schedule; Meet company and customer needs

Industry & Context.

Semiconductor
Problems you'll solve

Process characterization; Process optimization; Risk mitigation

What They're Looking For.

Must Have

PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience, 8 years' experience in semiconductor industry, Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology, Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI, project management skills, communication and presentation skills, Understanding of business needs and customers’ requirement, Ability to integrate & cooperate with people from cross function teams

What You'll Do.

Develop advanced packaging process solution

Lead new Technode process readiness

quality and reliability

Enable best technology for New Technode

Drive & collaborate with cross functional teams

Resolve process related problems

Ensure smooth transition from new process development

Ensure 1st qualification success

Ensure small volume production launch

Develop and Qualify new packaging process

Develop and Qualify new material

Develop and Qualify new equipment

Develop and Qualify new technology solutions

Execute risk mitigation

Ensure process recipe readiness

Identify path finding opportunities

Integrate process knowledge between upstream and downstream

Understand future trend

technology and capabilities

Enhance process performance

Provide new solutions on time

develop and establish process capabilities

develop and establish process strategy

develop and establish process roadmap

Develop & engage creative solutions for new capabilities

Develop & engage creative solutions to overcome process

How You'll Work.

Team & Collaboration

Cross functional teams

Communication Scope

Presentation skills

Process & Methodology

Project management

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. **Ensure smooth transition from new process development, 1st qualification success to small volume production launch** * Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule * Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. * Qualify new process/technology/equipment/materials **Technical capability** * Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations * To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process * Understand the future trend, technology and capabilities required for future pack

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