Amazon Development Center U.S., Inc.
Technology
AppliedScientist,QuantumDevicePackaging&EnvironmentR&D,DeviceTeam,AWSCenterforQuantumComputing,DeviceTeam
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Applied Scientist, Quantum Device Packaging & Environment R&D, Device Team, AWS Center for Quantum Computing, Device Team at Amazon Development Center U.S., Inc.. Skills: Quantum device packaging, Environmental R&D, Superconducting quantum devices, Cryogenic measurement science. Develop packaging and environmental R&D. Design packaging solutions”
What You'll Achieve.
Drive improvements in qubit performance
Industry & Context.
Superior problem solving
What They're Looking For.
Must Have
3+ years cryogenic packaging design/testing, 3+ years microwave engineering, 3+ years quantum hardware characterization, Master's degree in electrical engineering, Master's degree in computer science, Master's degree in mathematics, Master's degree in physics, Experience programming in Java, Experience programming in C++, Experience programming in Python, Experience in patents or publications, Experience in top-tier conferences, Experience in top-tier journals, Familiarity with cryogenic systems, Familiarity with low-temperature measurement environments
Nice to Have
PhD in electrical engineering, PhD in computer science, PhD in mathematics, PhD in physics, Hands-on experience with superconducting quantum device packaging, Knowledge of sources of decoherence, Knowledge of loss in superconducting qubit systems, Track record of driving R&D, Experience using Unix/Linux, Experience in professional software development
What You'll Do.
Develop packaging and environmental R&D
Design packaging solutions
Model packaging solutions
Test packaging solutions
Build electromagnetic models
Build mechanical models
Predict packaging performance
Optimize packaging performance
Characterize packaging at cryogenic temperatures
Design test standards
Develop test standards
Characterize DC qubit environment
Characterize microwave qubit environment
Automate data collection
Develop automated reporting pipelines
Enable scalable characterization
Identify sources of environmental noise
Mitigate sources of environmental noise
Identify integration uncertainty
Mitigate integration uncertainty
Drive improvements in qubit performance
Optimize off-chip environment
Contribute to roadmap planning
Establish scientific foundation
How You'll Work.
Team & Collaboration
Multi-disciplinary team; Hardware engineers; PCB designers; Circuit designers
Communication Scope
Excellent communication skills
Process & Methodology
Roadmap planning
Full Job Description
The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire an Applied Scientist on the Device Team, focused on packaging and environmental R&D for quantum devices. You will join a multi-disciplinary team of theoretical and experimental physicists, materials scientists, and hardware and software engineers working at the forefront of quantum computing. You should have deep expertise in the design, modeling, and testing of packaging and off-chip environments for microelectronic or quantum devices, with a strong understanding of how packaging and environmental factors impact qubit performance at cryogenic operating conditions. Candidates with a track record of original scientific contributions in packaging, microwave engineering, or quantum cryogenic hardware will be preferred. We are looking for candidates with strong scientific and engineering principles, resourcefulness and a bias for action, superior problem solving, and excellent communication skills. Working effectively within a team environment is essential. As an applied scientist at CQC, you will be expected to drive packaging and environmental R&D from concept through hardware demonstration and stay abreast of advances in quantum hardware packaging and cryogenic measurement science. Key job responsibilities In this role, you will develop packaging and environmental R&D for superconducting quantum devices. Your responsibilities will span four interconnected areas: Packaging R&D: Design, model, and test packaging solutions for superconducting quantum devices. Build electromagnetic and mechanical models to predict and optimize packaging performance, and characterize packaging at cryogenic temperatures. Environmental Test Standards: Design and develop test standards for characterizing the DC and microwave qubit environment, ensuring rigorous and reproducible assessment of off-chip environmental contributions to qubit decoherence and loss. Measurement Automation: Automate data co
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