AppliedScientist,MaterialsandProcessDevelopment,AWSCenterforQuantumComputing

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire an Applied Scientist on the Materials team, focused on materials integration and process development for superconducting quantum processors. You will join a multi-disciplinary team of theoretical and experimental physicists, materials scientists, and hardware and software engineers working at the forefront of quantum computing. You should have expertise in thin-film deposition, semiconductor integration processes, and materials characterization, with a strong understanding of how device topography and process sequences constrain materials integration choices. Candidates with a track record in materials integration for superconducting or semiconductor devices at wafer scale will be preferred. We are looking for candidates with strong scientific and engineering principles, resourcefulness and a bias for action, superior problem solving, and excellent communication skills. As an Applied Scientist at CQC, you will be expected to drive materials integration R&D from process development through hardware demonstration and stay abreast of advances in superconducting materials and semiconductor manufacturing. Key job responsibilities You will develop and optimize materials for superconducting quantum hardware, with an emphasis on thin-film deposition processes and materials solutions that enable integration architectures for scaling qubit density. This includes establishing process-structure-property relationships for production-relevant films and interfaces, qualifying new tools and process modules, and designing integration schemes compatible with larger wafer formats. You will coordinate with cross-functional teams to translate materials advances into production, and publish results in scientific journals when appropriate. Basic Qualifications: - PhD in mechanical engineering, electrical engineering, material science, physics or equivalent - Expertise in thin-film deposition and