Tenstorrent

Tech / AI / Software

AdvancedPackagingProcessEngineer

$100–500k santa clara, villa clara province, cuba; Taipei City, Taiwan Remote Friendly
The Brief

“Advanced Packaging Process Engineer at Tenstorrent. Skills: Advanced Packaging Process Engineering, 2.5D/3D chiplet packaging, foundry/OSAT collaboration, reliability and failure analysis. Drive advanced package technology and reliability. Own advanced package technology implementation for 2.5D/3D chiplet products”

What You'll Achieve.

push performance and manufacturability for next‑generation AI/ML products; drive yield; meet program needs; scaling reliable high-volume production

Industry & Context.

Tech / AI / Software
Problems you'll solve

solving hard problems; root cause analysis; evaluate tradeoffs; accelerate risk assessment

Eligibility Requirements

Eligibility to access U.S. export-controlled technology, Compliance with U.S. export laws (EAR), Citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency may be required

What They're Looking For.

Must Have

MS/PhD in a relevant field (Materials, Mechanical, Electrical, Physics, or related), 5+ years in advanced packaging for high-performance semiconductors from NPI through production (2.5D/3D flows such as CoWoS, FOCoS, EMIB, FCBGA or equivalent)

What You'll Do.

Drive advanced package technology and reliability

Own advanced package technology implementation for 2.5D/3D chiplet products

Act as primary technical interface to foundries/OSATs

and architecture teams to evaluate tradeoffs

Lead test vehicle planning to meet program needs

How You'll Work.

Team & Collaboration

close partnership with foundries and OSATs; cross-functional collaboration; Partner with design, reliability, and architecture teams

Communication Scope

clear communication

Free ATS check

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