4thShiftTechnicalLead–SemiconductorFab

**Date Posted:** 2026-05-29 **Country:** United States of America **Location:** US-MA-ANDOVER-AR2 ~ 362 Lowell St ~ AR2 PLYMOUTH BLDG **Position Role Type:** Onsite **U.S. Citizen, U.S. Person, or Immigration Status Requirements: ** The ability to obtain and maintain a U.S. government issued security clearance is required.​ U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance **Security Clearance Type:** DoD Clearance: Secret **Security Clearance Status:** Active and existing security clearance required after day 1 At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. An exciting opportunity exists at Raytheon for a technical lead to join our semiconductor foundry engineering leadership team within the RF Microelectronics/Module Design & Foundry Services (RFMicro) Department. The **_4th Shift Technical Lead – Semiconductor Fab_** role would be responsible for directing a group of skilled process engineers to fabricate advanced microelectronic devices in accordance with various technology roadmaps in support of Raytheon Technologies business pursuits. These road maps consist of both near term efforts on the cusp of transition-to-production, as well as longer term development efforts that maintain a pipeline of innovation. The ideal candidate will have experience in III-V semiconductor processing, preferably in GaAs, GaN, or GaSb. They will make real-time production decisions, review process changes, identify and champion process improvement opportunities, work to improve process yields, and interface with operations management. They will facilitate the effective allocation of t